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Grinding
Polishing
CMP
Bonding/Cleaning/Brushing
Semiautomatic single-axis grinding machine is a high-precision grinding machine with simple operation, abundant function and high cost performance, is equipped with automatic thickness measurement and compensation system in manual loading, can grind wafers to the required value automatically. The operating table can be customized according to customer requirements and has a wide range of applications.
Semiautomatic Double-axis Grinding Machine is a high-precision grinding machine which is equipped with two grinding wheel shafts, has the function of automatic thickness measurement and compensation system, manual loading, moving to fine grinding position after rough grinding, grinding wafers to the required value automatically. The operating table can be customized according to customer requirements and has a wide range of applications.
The full automatic grinding machine is a high-precision grinding machine equipped with fully automatic loading and unloading system, uses wafer manipulator to pick up the wafers, has automatic centering, cleaning and drying functions. It can realize automatic grinding process from cassette to cassette, and keep wafers dry in and out.
The horizontal grinding machine is a small, high-precision grinding machine with high cost performance in manual loading, the grinding wheel shaft is installed in a horizontal way, the wafers are manually loaded, and the removal of grinding is controlled by grinding wheel feed. The operating table can be customized according to customer requirements and has a wide range of applications.